| AB |
| C |
|
| cutting force |
Mizobuchi, Akira |
| DEFGH |
| I |
|
| intermittent cutting |
Mizobuchi, Akira |
| JKLM |
| N |
|
| nitride semiconductor |
|
| ≫ nitride semiconductor films |
Kusaka, Kazuya |
| nitride semiconductor films |
Kusaka, Kazuya |
| O |
| P |
|
| photocatalyst |
Yonekura, Daisuke |
| Q |
| R |
|
| residual stress |
Kusaka, Kazuya / Yonekura, Daisuke |
| S |
|
| sawing |
Mizobuchi, Akira |
| sputtering |
Kusaka, Kazuya / Yonekura, Daisuke |
| surface roughness |
Mizobuchi, Akira |
| T |
|
| tensioning method |
Mizobuchi, Akira |
| thin film |
Yonekura, Daisuke |
| tipped saw |
Mizobuchi, Akira |
| tool life |
Mizobuchi, Akira |
| tool temperature |
Mizobuchi, Akira |
| tool wear |
Mizobuchi, Akira |
| transparent conducting oxide |
Yonekura, Daisuke |
| transparent conducting oxides (→ transparent conducting oxide) |
| U |
|
| ultra-precision cutting |
Mizobuchi, Akira |
| ultrasound |
Yonekura, Daisuke |
| V |
| W |
|
| welding |
Yonekura, Daisuke |
| X |
|
| X-ray diffraction |
Kusaka, Kazuya |
| YZ |